Samsung is expected to more than double output of its HBM4 and HBM4E DRAM

	Samsung is expected to more than double output of its HBM4 and HBM4E DRAM(en.sedaily.com)
	547 points by giuliomagnifico 23 days ago \| 444 comments
	tl;dr: Samsung plans to more than double HBM4 and HBM4E output next year, signaled by a 2.5x increase in glass carrier demand (to 50,000 sheets/month) used to support wafers during thinning for high-stack HBM production. Overall HBM wafer capacity is expected to grow ~40% to 250,000 wafers/month, with the HBM4 family rising from ~40% to ~80% of shipments as 12-layer HBM4E ramps up, following sample deliveries to customers including Nvidia.
	HN Discussion: ~Concern that increased HBM production will worsen consumer DRAM availability and pricing ↑Hope that increased supply will lower GPU or cloud compute prices ↑Interest in the technical die-thinning process highlighted in the article •Skepticism that even doubled output will satisfy AI demand or reach consumers •Related context about HBM being the real bottleneck for Chinese AI accelerator production